The KEO products cover wet type processing equipment for SEMICON, PCBA and SMT industry, cleaning applications like Wafer, CMOS, Flexible PCB, PCBA Flux, Stencil, Squeegee, Wave Pallets, Reflow filters etc.
A low and middle volume PCBA batch cleaner for flux residual. Clean, rinse and dry sections are completed in one chamber. Max clean capacity: 610mm ( L) *560mm (W) *1OOmm{H)
lnline Cleaning Machine for High volume PCBA Cleaning. Standard process: Pre cleaning->Cleaning->Chemical isolation---Pre rinsing-Wind cut isolation---Rinsing-- Rinsing 2---Final spray--- Wind knife 1 cutting water-- Wind knife 2 cutting water --- Hot air drying
Fully Automatic Pneumatic stencil cleaning machine Compact, Easy to operate, Easy Maintenance Process: Cleaning and warm air dry Max Stencil size: 750 X750X40mm
Fully Automatic stencil cleaning machine for water based cleaning solutions Process: Cleaning-Chemical isolation- Rinsing (Open/ close loop) - hot air knife drying Max Stencil size: 750 X750 X40mm
Wave pallet, reflow filters cleaning machine. Cleaning Process: Cleaning Chamber, Rinse Chamber, Dry Chamber(Optional) Cleaning principle: Ultrasonic + bubbling + overflow Cleaning chamber dimensions: 675 mm (L)x705 mm (W) x300 mm (H)
Fully Automatic wave pallet, reflow filters cleaning machine. Process: Cleaning, rinsing and hot air dry in single chamber Cleaning Area dimensions: 1040mm X height 518mm
Fully Automatic Semicon Wafer cleaning Machine 8-12 Inch single wafer dry-in/dry out clean platform for particle/(in)organic/flux cleaning in advance package process
Fully Automatic stencil cleaning machine for water based cleaning solutions Process: Cleaning-Chemical isolation- Rinsing (Open/ close loop) - hot air knife drying Max Stencil size: 750 X750 X40mm
Fully Automatic Semicon Wafer cleaning Machine 8-12 Inch single wafer dry-in/dry out clean platform for particle/(in)organic/flux cleaning in advance package process